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Senior/Staff Quality Assurance Engineer or Manager (OSAT)

Lumilens
CompanyLumilens
CategoryEngineering
LocationSingapore
RemoteOn-site (inferred)
EmploymentNot stated
LevelManager
SalaryNot stated by the employer
Posted21 Jul 2026
Last verified10 Aug 2026
SourceEmployer ATS (ashby)
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Description
Responsibilities: Quality Management - Design, monitor and maintain the overall quality standards for semiconductor assembly and test processes. - Develop and maintain quality documentation, including Control Plans, PFMEA, Process Flow Charts, incoming & outgoing Quality requirements and Work Instructions. - Ensure compliance with customer, industry, internal quality requirements, as well relevant ISO (such as ISO9001). Problem Solving & Failure Analysis - Lead root cause analysis (RCA) using 8D, 3x5 Why, Fishbone, and other quality tools. - Drive corrective and preventive actions (CAPA) for quality excursions and customer complaints. - Support failure analysis activities and coordinate with engineering teams for resolution. Process Control & Improvement - Monitor process capability using SPC methodologies. - Analyse yield, defect trends, and reliability data. - Lead continuous improvement projects to reduce defects and improve yield performance. Supplier & Customer Quality - Support supplier audits and qualification activities. - Interface with OSAT partners, customers, and internal stakeholders regarding quality issues at OSAT. - Manage the change control request review and approval, related to materials, processes, and equipment. Audits & Compliance - Conduct internal and external quality audits. - Support customer audits and certification activities. - Ensure compliance with QMS, ISO 9001, (16949), JEDEC, and customer-specific requirements where applicable.   Required Qualifications - Bachelor's Degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field. - 5+ years of semiconductor assembly and test Quality experience, preferably in OSAT, or IDMs. - Knowledge of semiconductor packaging technologies such as Flip Chip, BGA, QFN, WLCSP – bumping, fan-out, back-grind, wafer saw, 2.5D/interposer assembly. Wafer & Final Test quality experience is an added advantage. Technical Skills - Statistical Process Control (SPC) - Failure Analysis (FA) - FMEA / PFMEA - CAPA - 8D Problem Solving - DOE (Design of Experiments) - Yield Analysis & Defect Reduction - Reliability Engineering - QMS - ISO 9001, IATF 16949 - Minitab, JMP, Excel, SQL (preferred)   Preferred Skills - Strong analytical and troubleshooting skills. - Excellent communication and presentation abilities. - Experience working with OSAT subcontractors and cross-functional teams. - Ability to manage multiple projects and drive quality improvements independently.