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At  Kandou , we are redefining the economics of AI infrastructure. Our mission is to  democratise AI by significantly reducing the Total Cost of Ownership (TCO)  of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology  powers a  high-performance, chiplet-based AI memory fabric  that is both  scalable and energy-efficient . Unlike traditional interconnects, our solution  reduces power consumption significantly  while preserving  high bandwidth and ultra-low latency  — unlocking unprecedented efficiency for AI training and inference at scale. Kandou’s architecture is not just an incremental improvement — it’s a  foundational shift  in how AI hardware is built for the future. Senior SI/PI Engineer either based in Hyderabad, Bangalore or Taiwan. We are looking for a Senior SI/PI Engineer with strong hands-on experience in signal integrity and power integrity for semiconductor, package, PCB, and high-speed interconnect applications. The ideal candidate will have deep expertise in electromagnetics, system-level design, material interactions across package, PCB, connector, and cable domains, and the ability to solve complex high-speed design challenges in real-world systems. Key Responsibilities • Perform and lead theoretical and simulation-based SI analysis of PCB products, channels, test structures, and system implementations. • Drive Signal and power delivery solutions for PCB and Package and evaluation platforms in collaboration with design teams. • Work closely with circuit designers to ensure robust SI/PI implementation in silicon. • Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges. • Engage with customers and suppliers to define and validate hardware solutions including packages, PCB/backplane layouts, materials, interposers, and connectors. • Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders. • Evaluate and benchmark signaling schemes such as Chord signaling and PAM in terms of SI/PI performance, power, and implementation trade-offs. Required Experience • 12+ years of experience in the semiconductor industry, with a focus on signal and power integrity. • Strong foundation in electromagnetics and system-level design, including material behavior across package, PCB, board, connector, and cable, as well as analog, power, and digital electronics. • Proven experience solving significant SI problems through innovative connector, package, or cable design. • Hands-on problem-solving ability with the capability to quickly grasp new concepts and translate them into practical solutions. • Strong cross-functional communication skills and a collaborative working style. • Experience with high-speed interfaces including DDR5 and PCIe. • Experience with Cadence board layout environments and SI/PI tools. Technical Skills • Deep understanding of SI/PI design and simulation across abstraction levels, from EM modeling to system-level link behavior. • Expertise with EM/SI/PI tools and modeling flows, including calibration, correlation, and validation. • Familiarity with lab measurements using VNA, spectrum analyzers, and high-speed oscilloscopes. • Strong intuition for EM simulation trade-offs, including accuracy, runtime, model complexity, and design impact. • Experience with channel modeling and extraction for multi-Gbps systems, including end-to-end link considerations. • Proficiency in Linux-based design environments and scripting for modeling and automation. • Solid understanding of signaling schemes and link architectures, including performance, complexity, and power trade-offs. Preferred Qualifications • Experience with DDR5 interface analysis, routing considerations, and channel optimization. • Experience with PCIe channel design, equalization, and validation. • Hands-on experience with Cadence Allegro, Sigrity, Clarity 3D, and related toolset. • Exposure to advanced PCB Layout techniques for large server-based systems • Strong documentation and presentation skills for technical reviews and customer communication. Education • Required: Master’s degree in Physics, Electronics, Electrical Engineering, or equivalent. • Desired: PhD in electromagnetics-related areas such as Physics, Electrical Engineering, or Electronics Engineering. If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It! www.kandou.ai