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Operations 3rd Party Foundries : • Co-ordinate all Wafer Manufacturing related activities. • Ensure available capacity is in place to cover both STP and LTP volumes. Taking into account type split and capacity bottlenecks. • Drive BBSC for all 3rdParty Foundries for Delivery, through put time, Yield and Quality including follow up on improvement actions • Monitor, review and manage any process changes/improvements supporting requests both from 3rd Party Foundries to BL’s and from BL’s to 3rd Party Foundries. Co-ordinate and drive solutions to customer complaints hold lots and yield/processing excursions related to 3rdParty Foundry ensuring route cause is understood and corrective actions are in place. Program management 3rdParty Foundries: • Define time-line, resources, risk-mitigations (technical & non technical)activities to ensure timely and satisfactory completion of the project • Be responsible for monitoring and controlling the execution of the project as per agreed time-line • Drive all new product transfers activities in External Foundries with support of NXP project team (Innovation, mother fab, BL) and local project team of External Foundry • Actively coordinate process qualification, product introduction and qualification • Stimulate/oversee structural problems solving by use of statistical and quality tools • Chair and organize process gate meetings • Report to NXP stakeholders and External Foundries counterparts (PRB/Steering Committee) • Be the interface between NXP and External Foundries during project execution • Coordinate safe-launch and volume ramp-up implementation, monitor with support of the local technical team continuous yield & process improvement activities General areas of responsibility include: • Relation management and communication interface to all 3rdParty Foundries within their area. • Drive Quarterly review with 3rdParty Foundries including follow up on actions • Support Foundry Sourcing group in cost/price negotiations and discussions with both existing and new 3rd Party Foundries Job Requirement : Minimum Qualifications: • Bachelor/Master in Engineering/Material Science/Electronic • Minimum 7 years working experience preferably in semiconductor fab environment (Process Integration, Device/Yield engineer preferred) • Well verse in English and Chinese • Able to work independently and also handle cross functional projects Preferred Qualifications: • Six sigma green belt and above, SPC knowledge, Semiconductor Devices and Process knowledge • Knows statistical tool KLA ACE XP, JMP, SPS etc More information about NXP in Singapore... LI-2370