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CHAOS Industries is redefining modern defense with a multi-product portfolio that gives the ultimate advantage—domain dominance. The company's products are powered by Coherent Distributed Networks (CDN™), empowering warfighters, commercial air operators, and border protection teams to act faster, adapt rapidly, and stay ahead of evolving threats.  CHAOS Industries was founded in 2022 and has raised a total of $1 billion in funding from leading investors, including 8VC, Accel, and Valor Equity Partners. The company is headquartered in Los Angeles, with offices in Washington, D.C., San Francisco, San Diego, Seattle, and London. For more information, please visit www.chaosinc.com . Role Overview:   CHAOS is seeking a Sr. Principal Electrical Engineer with expertise in digital circuit design and signal integrity analysis to serve as a technical authority for high-reliability digital electronics used in aerospace and military applications. This role spans the full product lifecycle, from early architecture and requirements shaping through detailed design, analysis, verification, production support, and fielded system sustainment.   The ideal candidate is a senior digital hardware technical authority with deep high-speed board design, signal integrity, and power integrity expertise; a track record of setting design direction across programs; and the ability to guide cross-disciplinary teams through ambiguous, high-consequence hardware challenges.   This is a full-time, on-site position in El Segundo, CA.     Responsibilities:   Act as a technical authority for high-speed digital circuit design, signal integrity, and power integrity across multiple programs or product lines   Lead design and review of complex PCBAs involving FPGAs, processors, memory devices, data converters, clocks, high-speed serial interfaces, and mixed-signal boundaries   Lead digital hardware architecture trades and define design approaches that satisfy system performance, schedule, manufacturability, reliability, and qualification requirements   Set standards, procedures, and review practices for digital board design, stack-up definition, layout constraints, SI/PI analysis, bring-up, and verification   Resolve complex cross-disciplinary technical issues involving digital hardware, FPGA/software interfaces, RF coexistence, power distribution, EMI/EMC, thermal behavior, and mechanical packaging   Guide PCB layout strategy for controlled impedance, length matching, return paths, grounding, shielding, decoupling, power distribution networks, and isolation of sensitive circuits   Serve as the senior technical interface with customers, vendors, suppliers, and internal program leadership for digital hardware topics   Mentor engineers and coordinate technical activities across digital, FPGA, embedded software, RF, power, mechanical, manufacturing, and test teams   Serve as technical authority for hardware integration, verification, qualification testing, production transition, failure analysis, and field support     Minimum Requirements:   Bachelor's degree in Electrical Engineering with 15+ years of relevant engineering experience   Demonstrated technical leadership of complex high-speed digital hardware   Strong understanding of digital design fundamentals, including timing, clocking, controlled impedance, signal integrity, power integrity, grounding, decoupling, and return-path management   Extensive experience with digital board design involving FPGAs, processors, memory devices, high-speed data converters, and board-level communication interfaces   Experience setting PCB layout strategy and design review criteria for high-speed digital, mixed-sig