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Senior Platform & Hardware Applications Engineer (f/m/d)

Blacksemiconductor
CompanyBlacksemiconductor
CategoryEngineering
LocationAachen
RemoteOn-site (inferred)
EmploymentNot stated
LevelSenior
SalaryNot stated by the employer
Posted29 Jul 2026
Last verified9 Aug 2026
SourceEmployer ATS (ashby)
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Description
About us We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The Role The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role We are seeking a skilled Senior Platform & Hardware Applications Engineer at Black Semiconductor to enable successful customer adoption of our next-generation Optical Compute Interconnect (OCI) technology. Working closely with Product, Photonics, Packaging, Test Engineering, and Commercial teams, you will help customers successfully deploy our technology while providing valuable feedback from the field to drive future product improvements. Your work will span platform integration, high-speed system validation, reference design development, and technical support across the product lifecycle. This role combines high-speed hardware platforms, FPGA and ASIC bring-up, optical interconnect technologies, system validation, and customer-facing technical engineering. To join our team, your should be excited to - Guide customers in integrating Black Semiconductor products into ecosystem solutions such as switches, NICs, accelerators, ASICs, and FPGA-based platforms. - Support customer bring-up and debug activities, including link training, BER validation, interoperability testing, firmware configuration, and system-level issue resolution. - Develop example schematics, reference boards, application notes, and integration guides covering power delivery, clocking, fiber and cable routing, management interfaces, pinouts, register maps, and thermal and mechanical guidelines. Contribute to SDKs and PDKs where appropriate. - Work closely with Product, Photonics, Packaging, and Test Engineering teams to communicate field issues, customer feedback, and feature requests that help shape future product development. - Support pre-sales activities including evaluations, demonstrations, and benchmarking, as well as post-sales debugging, technical escalations, customer training, and on-site laboratory support for key accounts. Your Qualifications - Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Physics, or a related technical field, or equivalent industry experience. - Strong experience with FPGA and ASIC SerDes bring-up, including demonstration and evaluation board PCB design, RTL development, IP integration, embedded software, tool flows, high-speed measurements, and interposer validation. - Strong customer-facing communication skills with the ability to explain complex signal integrity and optical system concepts, write technical application documentation, and coordinate multi-stakeholder debugging activities. - Good understanding of optical interconnect technologies, including optical transceivers, Co-Packaged Optics (CPO), optical chiplets, link budgets, NRZ/PAM4 modulation, equalization, and high-speed standards such as Ethernet, PCIe, CXL, and JESD204.