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Huawei's Boltzmann Research Center (Vienna) is responsible for advanced magnetic technology research, material and process development, design and strategic engineering of our magnetic component. We focus on the development of soft magnetic materials, permanent magnetic materials, and components which applied in Huawei's ICT products including power supply, wireless communication, etc. Through insight into global magnetic technologies and independent research, we aspire to explore and make breakthroughs in fundamental theories and technologies e.g., computation and simulation, formula design, molding process, etc. Join us as a Senior Engineer – Power Magnetics & Module Design (m/f/d) Your mission As a Senior Power Magnetics & Module Design Engineer, you will be responsible for the end-to-end design of high-density, packaging module & board-mounted power supplies. You will push the limits of W/in³ through advanced packaging, and high-frequency switching (MHz to tens of MHz), developing Point-of-Load (PoL) converters, IVR/VRMs, and isolated DC-DC modules that power the next generation of processors. Design & Optimization: Propose new concepts, design magnetics for package & board level DC-DC converters, optimizing for footprint, efficiency, and thermal performance. Engage in GPU/CPU power architecture design and holistic optimization, by performing comprehensive circuit simulations and PDN analysis to enhance power delivery networks. Advanced Packaging & Integration: Design advanced power module integration architectures, such as 3D stacking, PCB-embedded magnetics (magnetic paste, etc.), capacitor integration. Multi-Physics Verification: Develop and validate finite element analysis (FEA) models to simulate electromagnetic, thermal and mechanical behavior design. Perform simulations to evaluate electrical performance, stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of integration architectures. Prototyping & Fabrication: Collaborate with prototype teams, suppliers on fabrication, validating designs via physical testing. Tool Development & Automation: Develop custom simulation tools, scripts, and workflows to automate and streamline the simulation process for efficiency and consistency. Your areas of expertise Educational Background: Master's or PhD degree in Electrical Engineering, Microelectronics, or Material Science with a research focus on integrated power electronics (PwrSiP / PwrSoC). Experience: 4–6+ years of industry experience in power solutions, specifically in power magnetics and modules with deep understanding of data center power systems and all relevant power topologies. Experience with manufacturing/prototyping PCB/substrate-embedded magnetics & power module packaging is highly preferred. Technical Expertise: Demonstrated success in high-frequency, Package-level (IVR/FIVR), Board level (VRM/TLVR/isolated DC-DC) power module, System-level design of power delivery architectures for data center. Proficiency in the design of high-density inductors/planar transformers (LLC, HSC, etc.), with the ability to judge manufacturing and process feasibility. Solid knowledge and experience of advanced packaging technologies, substrate/assembly manufacturing methodologies, PCB/substrate-embedding fabrication process (plating, PTH processes, and solid copper pillar electroplating for substrate embedded passives). Strong knowledge of Silicon / LV GaN and hands on experience with stress, thermal and electrical modeling analysis and tools. In depth understanding of high-frequency magnetic material behavior, loss modeling, and reliability testing. Skills & Knowledge: Experience with FEM multi-physics simulations (COMSOL), including coupled electro-thermal-mechanical analysis. Familiarity with high-frequency magnetic material characterization (permeability, co