Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
eliyan
| Company | eliyan |
| Category | Engineering |
| Location | Bay Area |
| Remote | On-site (inferred) |
| Employment | Full-time |
| Level | Senior |
| Salary | Not stated by the employer |
| Posted | 20 Oct 2025 |
| Last verified | 11 Aug 2026 |
| Source | Employer ATS (lever) |
Description
Join the leading chiplet interconnect startup! We are seeking an experienced Senior/Staff Packaging Engineer specializing in electro-thermal simulation to join our advanced packaging team. You will develop comprehensive thermal and electrical simulations for next-generation semiconductor packaging solutions, including 2.5D/3D IC integration, chiplet-based systems, and advanced heterogeneous integration technologies. This role is critical in enabling high-performance computing, AI accelerators, and advanced chiplet architectures. We offer a fun work environment with excellent benefits. ONSITE M-F