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APEC Application Development Engineer – Tyvek® Consumer & Industrial

dupont
Companydupont
CategoryEngineering
Location2 Locations
Remote
EmploymentNot stated
LevelNot stated
SalaryNot stated by the employer
Posted31 Jul 2026
Last verified9 Aug 2026
SourceEmployer ATS (workday)
Applications are handled by the employer, not by us.Apply on the employer's site →
Description
Wir bei DuPont eröffnen der Welt mit unerlässlichen Innovationen Möglichkeiten zur Weiterentwicklung. Wir arbeiten an Dingen, die wirklich wichtig sind. Sei es die Bereitstellung von sauberem Wasser für mehr als eine Milliarde Menschen, die Herstellung von Materialien, die für alltägliche technische Geräte wie Smartphones oder Elektrofahrzeuge unerlässlich sind, oder der Schutz von Arbeitnehmern auf der ganzen Welt. Entdecken Sie die vielen Gründe, warum die talentiertesten Arbeitnehmer sich für DuPont als Arbeitgeber entscheiden. Warum DuPont? | Karriere bei DuPont : https://careers.dupont.com/de/de/whyjoinus INTRODUCTION This position is based   in   one   the APEC offices of   D uPont , a global leader in protective materials. As   Application Development Engineer , you will play a pivotal role in supporting customer needs by driving the development of new applications,   by   leading   the development of new products   and   providing   expert technical guidance on the use, handling, and management of DuPont   Tyvek®   products. ROLE & RESPONSIBILITIES In this role, you will: Industry & Customer Engagement: • Act as the primary technical interface between DuPont and semiconductor customers across Taiwan and the broader APAC region. • Develop strong relationships with wafer manufacturers, OSATs, advanced packaging companies, IC substrate producers, packaging material converters, and equipment suppliers. • Lead technical discussions, application reviews, product evaluations, and qualification activities with customers. Application Development • Drive the development of new Tyvek® applications in interleafing & active packaging. • Identify   unmet customer needs and translate them into application concepts, product requirements, and commercialization opportunities. Technical Leadership • Serve as the internal subject matter expert (SME) for semiconductor packaging, contamination control, ESD management, moisture protection, and interleafing applications. • Lead root-cause investigations and problem-solving activities related to particle contamination, ionic contamination, ESD performance, material handling, automation compatibility, and product performance. • Collaborate closely with global R&D, Product Management, Manufacturing, and Quality teams to develop and   optimize   solutions. Product Qualification & Commercialization • Support customer qualification activities through test planning, data analysis, and performance validation. • Generate technical evidence supporting key customer requirements • Drive   specification-in   activities and support commercial adoption. QUALIFICATIONS Education & Experience: Required • Master’s degree in   Elec tronic   Engineering ,   Physics,   Material Science,   Chemical Engineering,   or   a related field . • Minimum 5 years of experience in semiconductor materials, packaging materials, wafer handling, contamination control, semiconductor packaging, substrate manufacturing, or related applications. • Proven experience working directly with semiconductor customers in technical development, process engineering, application engineering, or product development roles. • Experience supporting cleanroom manufacturing environments. • Experience leading customer-facing technical projects from concept through commercialization. Preferred • Experience with semiconductor interleafing, wafer separators, IC substrate packaging, desiccants, cleanroom packaging, ESD packaging, or contamination-control materials. • Familiarity with semiconductor ecosystem companies such as foundries, memory makers, OSATs, substrate manufacturers, and packaging converters. • Knowledge of wafer fabrication, advanced packaging, chiplet architectures, AI/HPC supply chains, or semiconductor   logistics . • Experience with material qualification and semiconductor quality requirements. Skills & Competencies: • Strong analytical, creative, and conceptual thinking skills; results-driven mindset. • Excellent communication skills (written and oral) in English; • Self-starter with   proactive   attitude and ability to work independently. • Strong presentation and stakeholder engagement skills. • Proficiency   in MS Office (Word, Excel, PowerPoint, Outlook). • Willingness to learn and continuously develop technical   expertise . • Ability to travel up to   20 % -30% . Werden Sie Mitglied unseres Talentnetzwerks und bleiben Sie mit uns in Verbindung! https://careers.dupont.com/de/de/jointalentcommunity?applyType=JTC DuPont ist ein Arbeitgeber, der Chancengleichheit und Gleichbehandlung fördert. Die Bewerbungen qualifizierter Kandidatinnen und Kandidaten werden unabhängig von ethnischer Herkunft, Hautfarbe, Religion, Glaube, Geschlecht, sexueller Orientierung, Geschlechtsidentität, Familienstand, nationaler Herkunft, Alter, Veteranenstatus, Behinderung oder einer anderen per Gesetz geschützten Gruppe bearbeitet. Wenn Sie bei der Stellensuche oder Bewerbung auf angemessene Anpassungsmaßnahmen angewiesen sind, besuchen Sie bitte unsere Seite zur Barrierefreiheit. Dort finden Sie die benötigten Kontaktdaten http://www.dupont.com/accessibility.html DuPont bietet ein umfassendes Vergütungs- und Leistungspaket an. Um mehr zu erfahren, besuchen Sie die Seite zur Vergütung und den Leistungen https://careers.dupont.com/de/de/compensation-and-benefits