Job Opportunities API

About us We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects About our technology The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution The Role We are seeking a skilled Advanced Packaging Electrical / Signal Integrity Architect at Black Semiconductor to own the electrical characterization and co-design of our advanced packages. You will drive package-level electrical signoff by developing equivalent circuit models, leading signal and power integrity analysis, and translating high-speed interconnect requirements into optimized package architectures. Working closely with ASIC/SerDes designers, the Advanced Packaging Architect, and system teams, you will ensure our package designs meet demanding electrical performance targets while enabling Black Semiconductor's next-generation chiplet and advanced packaging technologies. This role bridges advanced packaging, high-speed electrical design, and simulation-driven package co-design. To join our team, you should be excited to - Own the electrical characterization and signoff of advanced semiconductor packages, including package equivalent circuit modeling, signal integrity (SI), power integrity (PI), crosstalk, and EMI/EMC analysis. - Develop and validate package-level electrical models (RLGC-equivalent circuits, S-parameters) for 2.5D/3D, interposer, fan-out, and chiplet-based package architectures while performing signal integrity analysis across die-package-board interfaces for high-speed SerDes, HBM, and die-to-die interconnects. - Define package stack-ups, substrate routing guidelines, via strategies, and bump-map/ball-out architectures from an electrical performance perspective, partnering closely with the Advanced Packaging Architect and ASIC teams to balance electrical, mechanical, thermal, manufacturing, and reliability requirements. - Build, validate, and correlate simulation models using industry-standard SI/PI and electromagnetic tools against laboratory measurements to support package electrical signoff and end-to-end channel performance. - Support chip-package-board co-simulation and end-to-end channel budgeting in collaboration with ASIC, SerDes, and system engineering teams. - Collaborate with OSAT and foundry partners throughout package development, qualification, and manufacturing to ensure robust electrical performance, manufacturability, and design-for-manufacturing (DFM) compliance. Your Qualifications - Bachelor's or Master's degree in Electrical Engineering, Electronics Engineering, Physics, or a related technical field, or equivalent experience. - 6+ years of experience in package or PCB signal integrity, power integrity, high-speed interconnect design, advanced packaging, or closely related hardware engineering roles. - Strong expertise in transmission line theory, electromagnetics, S-parameters, channel modeling, package equivalent electrical model deve