Job Opportunities API

Role Intent Take a lab/prototype semiconductor process (wafer bonding + photonic materials + fab module integration) and turn it into a repeatable, high-yield, well-documented pilot line process that can ship industry-grade sample lots with credible specs, traceability, and supply-chain stability. In short: from "it works" to "it ships." Core Responsibilities A. Define the pilot-line process architecture & roadmap Own the end-to-end process flow definition for the targeted platform (e.g., CMOS+ll1-V / CMOS+GaN, CMOS+ TFLN bonded substrates, on-insulator stacks), including module boundaries, critical interfaces, and maturity roadmap to pilot scale. B. Develop, optimise, and lock process recipes for scale Lead hands-on process development and optimisation across the critical modules, including (as applicable to the project): Wafer bonding process development (bond interface quality, dielectric thickness tuning, densification windows, yield ramp) MOCVD epitaxy development for 111-V / GaN on Si (uniformity, defect control, repeatability on 200 mm) Supporting unit processes: CMP, thermal processes/furnace steps, metallization readiness, coating/clean modules, and integration constraints for downstream foundry re-entry C. Yield engineering, process control, and pilot stability Implement the pilot-ready quality backbone: Define critical-to-quality (CTQ) parameters and establish SPC/PC monitors Drive root-cause analysis for excursions and systematic defects Own yield ramp plans and sustainment (targeting consistently high bonding and epi outcomes) D. Equipment & metrology strategy (selection --> qualification --> uptime) Select, qualify, and operationalize toolsets required for pilot production, including tool acceptance criteria, recipe portability, and preventive maintenance routines. E. External foundry and supplier coordination Act as the technical owner interfacing with: External foundries for wafer processing/ re-entry flows and back-end integration Epi/material suppliers and local/global supply chain stabilization (qualification plans, incoming specs, performance scorecards) F. Documentation & "transfer package" for industry sampling Produce the full pilot-line transfer kit: Process flows, BOMs, specs, recipes, control plans, FMEAs Lot genealogy + traceability structure Industry sampling documentation (sample CoC/CoA expectations, reliability test hooks, measurement definitions) G. Team leadership & execution cadence Lead a multi-disciplinary engineering team spanning process, integration, metrology, and equipment functions. Establish effective execution cadence and drive structured troubleshooting to deliver stable pilot outcomes. Requirements Proven experience in semiconductor process development, integration, or pilot-line scale-up Hands-on expertise in wafer bonding, epitaxial growth (111-V and/or GaN), and supporting unit processes such as CMP, thermal processing, and metallization readiness Experience defining end-to-end process flows and transitioning technologies from lab or prototype stage to pilot production Strong background in yield engineering, SPC, process control, and root-cause analysis Experience selecting, qualifying, and sustaining semiconductor process equipment and metrology tools Experience producing comprehensive process documentation and transfer packages suitable for industry-grade sampling Prior experience leading or mentoring multi-disciplinary engineering teams Ability to operate effectively in a pilot environment with evolving processes, tight timelines, and cross-functional dependencies Please be informed that only shortlisted candidates will be notified. Job Type: 2-Year Contract Location: Kent Ridge Campus Organisation: NUS Enterprise