Technical Program Manager (f/m/d)
Blacksemiconductor
| Company | Blacksemiconductor |
| Category | Uncategorised |
| Location | Aachen |
| Remote | On-site (inferred) |
| Employment | Not stated |
| Level | Not stated |
| Salary | Not stated by the employer |
| Posted | 28 Jul 2026 |
| Last verified | 30 Jul 2026 |
| Source | Employer career page (ashby) |
Description
About us
We see the semiconductor industry as a realm of possibility. We see opportunity. We see the profound impact that our graphene solutions will have in transforming the industry. We invite you to join us in driving change with our fundamentally human-centered approach, uniting bright minds around a shared vision. The vision is: Prove to everybody that you can make a fundamental change. Prove with your knowledge and skills how things can be done differently. Together, we can change the paradigm of how the world connects
About our technology
The semiconductor industry’s growing demand for more powerful chips with higher bandwidth and lower power finds its solution in our technology. We connect chips to high-throughput, low-delay computing networks. The key lies in harnessing the physical properties of graphene to combine electronic computing with photonic communication, allowing countless chips to interact almost as if they were one. Our graphene photonic innovation increases computing power and efficiency to a new order of magnitude
In short, we connect chips to create powerful and energy-efficient networks, overcoming connectivity limitations in the semiconductor industry. We deliver the graphene solution
The Role
We are seeking a skilled Technical Program Manager at Black Semiconductor to lead the development and delivery of next-generation ASIC programs combining electronics and photonics in advanced chiplet packages. You will oversee complete silicon and chiplet product programs from concept through implementation, validation, qualification, and release to production, ensuring delivery against technical, schedule, cost, and quality objectives.
Working closely with engineering teams, product management, external IP partners, qualification providers, supply chain, and operations, you will drive cross-functional execution, identify integration risks early, and align teams around program priorities and milestones. This is a hands-on mid-level role where you will own defined programs end-to-end, combining strong program management skills with sufficient technical fluency to anticipate integration and schedule risks before they impact delivery.
To join our team, you should be excited to
- Lead cross-functional ASIC and chiplet development programs, defining milestones, integration plans, schedules, critical paths, and risk mitigation strategies from concept through product release.
- Coordinate the development and delivery of electronic and photonic integrated circuit programs, including multi-die/chiplet integration, known-good-die qualification, development builds, and production readiness.
- Partner closely with Product Management to translate product requirements and priorities into executable technical program plans, managing scope, dependencies, and schedule trade-offs throughout execution.
- Own relationships with external IP vendors, qualification providers, and suppliers by coordinating deliverables, review cadences, resource planning, and escalations to ensure alignment with program milestones.
- Drive Program Core Team execution, resolve technical and cross-functional issues, and communicate progress, risks, and decisions effectively across engineering teams and leadership.
- Maintain accurate program documentation, ensuring plans, decisions, risks, and deliverables remain current, complete, and accessible.
Your Qualification
- Bachelor's degree in Engineering, Computer Science, or a related technical field, or equivalent practical experience.
- 5–8 years of experience managing silicon, ASIC, IP, or photonics development programs, with proven ownership of semiconductor product lifecycles from concept through implementation, validation, qualification, and release.
- Experience managing complex semiconductor programs involving external IP vendors, qualification providers, or test houses, ideally within chiplet, multi-die, or advanced packaging environments.
- Strong ability to
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