Job Opportunities API

Join our fast-paced and passionate team as a Senior Mechanical Engineering Analyst. As we scale, you will be instrumental in building our foundation from the ground up. This is a dynamic, hands-on role for a self-starter who thrives in a fluid startup environment. You'll have the opportunity to work on cutting edge technologies, work closely with leadership, and develop and implement engineering practices that support our mission and growth. Your key responsibilities are as follows: Work independently and in a team while over communicating with the manager, project engineer and the teammates. Will mentor junior engineers. Execute complex engineering tasks involving planning, preparation, data/information collection and analysis and decision-making in a process involving peer reviews and documentation of the results. Use tenacity, patience, self-discipline and passion for excellence to assure accuracy of execution schedule, data quality/integrity, conformance to company best practices, clarity in communication and documentation. Use every opportunity to grow competency thru mentorship, curiosity, communication, exposure and initiative. Requirements This position requires access to export-controlled information. Employment is contingent upon the applicant being a U.S. person as defined by 8 U.S.C. § 1324b(a)(3). Experience: A bachelor’s degree in mechanical engineering, Physics, or a related field. Master’s or PhD preferred. Minimum of 5 years of relevant experience, ideally within a startup or technology company. Skills: Structural, Shock & Vibration Analysis Dynamic Structural Analysis: Proven experience performing vibration, mechanical shock, and acoustic analyses on complex systems, specifically targeting sensitive photonics modules and rack structures. Experience analyzing viscoelastic materials is a bonus. Advanced Shock Modeling: Expertise in transient shock and pyroshock analysis, with the ability to proactively design and analyze for aerospace/space applications even in the absence of finalized customer specifications. Thermal-Mechanical Simulation: Strong background in conducting transient thermal analyses and coupled thermal-shock/thermal-cycling simulations at the photonics module and individual joint levels. Adhesive, Bonding & Joint Reliability Advanced Bonding Analysis: Deep technical expertise in adhesive bond analysis, specifically evaluating large glue bonds and joint interfaces to maximize manufacturing yield and structural reliability. Reliability & Yield Optimization: Ability to leverage thermal cycling and vibration simulation data to mitigate joint failures, optimize yield, and improve overall product lifetime. Solder Joint Reliability: Deep expertise in modeling and analyzing solder joint interfaces, specifically predicting long-term reliability under complex operational loading. Creep & Fatigue Modeling: Advanced capability in performing non-linear, time-dependent creep and thermo-mechanical fatigue analyses to predict solder joint degradation, crack initiation, and cycles-to-failure. Optomechanics & Materials Characterization Optomechanical Packaging: Experience analyzing and optimizing low-cost packaging approaches. Fracture Mechanics: Skilled in generalized glass fracture analysis and window joint/cracking analysis Thermal Simulation & Management Module-Level Thermal Simulation: Expertise in developing high-fidelity, component-level thermal models to analyze transient heat dissipation, localized hot spots, and interface temperatures within high-power modules. Thermal Management Systems Design: Proven experience architecting full, system-level thermal management solutions, integrating active and passive cooling technologies (e.g., liquid cooling loops, heat pipes, thermoelectric coolers, and forced convection). Multi-Scale Thermal Modeling: Ability to seamlessly bridge the g