Senior Avionics Electronics Enclosure Engineer
True Anomaly
| Company | True Anomaly |
| Category | Engineering |
| Location | Long Beach |
| Remote | On-site (inferred) |
| Employment | Not stated |
| Level | Senior |
| Salary | Not stated by the employer |
| Posted | 21 Jul 2026 |
| Last verified | 30 Jul 2026 |
| Source | Employer career page (greenhouse) |
Description
Space is a warfighting domain. True Anomaly seeks those with the talent and ambition to build the technology that secures it.
OUR MISSION
True Anomaly delivers decisive capabilities for space superiority. We build autonomous spacecraft, advanced payloads, mission software, and space-based interceptors — enabling the U.S. and its Allies to secure the space environment and counter threats from the ultimate high ground.
OUR VALUES
Be the offset. We create asymmetric advantages with creativity and ingenuity.
What would it take? We challenge assumptions to deliver ambitious results.
It’s the people. Our team is our competitive advantage and we are better together.
YOUR MISSION
True Anomaly is seeking a skilled and detail-oriented Senior Avionics Electronics Enclosure Engineer to join our Mechanical and Structures organization, fully dedicated to supporting the Avionics Components and Payloads teams. In this role, you will own the mechanical design of avionics electronics enclosures from concept through qualification — engineering housings, brackets, and structural assemblies that protect and integrate our flight electronics while relentlessly driving down mass, managing thermal performance, and surviving the rigors of launch and on-orbit operation. You bring deep expertise in precision mechanical design for space hardware, fluency in structural and thermal analysis, and a hands-on prototyping mindset that lets you iterate quickly from concept to hardware.
RESPONSIBILITIES
Own the mechanical design and development of avionics electronics enclosures, housings, brackets, and structural assemblies for spacecraft avionics and electrical payload systems
Drive mass optimization throughout the design process, applying topology optimization, advanced materials selection, and design-for-manufacture principles to minimize enclosure mass without sacrificing structural margin
Collaborate closely with avionics, EPS, and payload electrical engineers to ensure enclosure designs meet all PCB mounting, connector access, harness routing, and thermal interface requirements
Apply and enforce tight geometric dimensioning and tolerancing (GD&T) practices to ensure precise fit, alignment, and repeatability across electronics enclosure assemblies
Produce and iterate rapid 3D printed prototypes to validate fit, form, and function ahead of formal fabrication
Create or support the creation of engineering drawings, BOMs, and fabrication documentation to support manufacturing and procurement
Perform or support thermal analysis of electronics enclosures, including conductive and radiative thermal modeling, which ensures component temperatures remain within qualification limits across all mission environments
Perform or support structural dynamics modeling of enclosure assemblies including modal, random vibration, and shock analysis that verifies compliance with launch environment requirements
Support integration and test activities, including environmental test campaigns, and assist in troubleshooting mechanical integration issues
Develop and maintain design documentation including specifications, analysis reports, and test plans
QUALIFICATIONS
Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or related field
5+ years of professional experience in precision mechanical design for aerospace, defense, or high-reliability electronics applications
Demonstrated expertise in electronics enclosure or chassis design, including structural, thermal, and mass optimization considerations
Proficiency in 3D CAD tools (NX or SolidWorks preferred) and experience generating detailed engineering drawings with GD&T
Experience with structural dynamics analysis including modal, random vibration, and shock response, using FEA tools (NASTRAN, ANSYS, or equivalent)
Experience with thermal a
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