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We are scientists, doctors, techies and humanity lovers, with the mission of building neuroelectronic interfaces to cure brain disorders. INBRAIN harnesses the extraordinary material properties of Graphene, the world’s thinnest and nobel-prize winning material, to build safe, uninvasive and highly efficient neural solutions.  Our mission is to decode and modulate neural networks to improve people's lives As a  Senior Advanced Packaging Engineer, you will be the technical architect of metrology, electrical test and data analysis infrastructure. The primary goal is to invent, build and operate the automated test systems required to characterize complex vertical integration processes (advanced packaging, TGV, electromechanical reliability).  You will be at the forefront of bringing advanced healthcare solutions to market, making a tangible difference in people´s lives worldwide. This position will be office-based in Bellaterra.  Main responsibilities: Test Strategy & Equipment Setup:  Define and deploy the test infrastructure required to characterize 3D MEMS process steps thermal bonding, wafer-level packaging, TGV, electrochemical or mechanical reliability testing. Specify, qualify and operate metrology, electrical test, and reliability equipment. Process Characterization & DOEs:  Design and execute structured experiments to characterize 3D MEMS unit processes and integrated flows. Generate the data needed to set process windows, control limits, and acceptance criteria across coupled process steps.  Data Analysis & Industrialization:  Build Python-based data pipelines to analyze high-volume process and test data. Extract yield, Cpk, drift, and failure-mode signatures. Translate findings directly into process and test recipe improvements.  Hardware & Electrical Characterization: Lead electrical and physical characterization across 3D MEMS structures. Use SMUs, DAQs, oscilloscopes, probe stations, and dedicated MEMS test rigs to measure critical parameters at the required precision.  Materials & Failure Analysis: Apply materials science fluency, thin films, interfaces, integration physics, to root-cause analysis on failures across, bonding, packaging, TGV interfaces and electromechanical reliability. Feed findings back to process and design teams to drive iterations.  Cross-Functional Coordination: Work directly with Process Integration, Packaging, Hardware, mechanical and Software teams to align test requirements, hardware specifications, and data infrastructure. Translate 3D MEMS physics into testable specifications across disciplines.  Industrialization & Scaling: Take prototype test setups out of R&D and harden them for pilot and production. Author SOPs, qualify equipment (IQ / OQ / PQ), and integrate with MES where applicable.  Continuous Improvement: Identify opportunities to reduce variation, improve test throughput, and tighten the link between process control and electrical / yield outcomes across the 3D MEMS stack. Mandatory Qualifications and Soft skills: Bachelor’s or Master’s degree in Electrical Engineering, Applied Physics, Materials Science, Microelectronics, or a related field.  5+ years in Test Development, Device Characterization, or Yield Engineering within a semiconductor, MEMS, or advanced packaging environment.  Vertical Integration & MEMS Expertise: Hands-on experience with testing and characterizing advanced packaging architectures, including wafer-level thermal bonding, Through-Glass Vias (TGV) / TSV metallization, and electromechanical reliability.  Data Science & Scripting: High proficiency in Python (e.g., Pandas, NumPy, SciPy) for complex data analysis, instrument control (SCPI/VISA), and automating high-volume, lot-level data workflows. Test Equipment & Instrumentation: Hands-on expertise building test setups with SMUs, DAQs, oscilloscopes, and automated metrology tools. Highly ca