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Job Title:  R&D Engineer - Process Integration Location:  Covington, GA Job Type:  Full-Time   About Us:  Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens of clients globally. By dedicating our efforts to establishing large glass substrates with built-in active and passive elements, our goal is to provide significant improvement in signaling characteristics and power consumption compared to existing solutions.   Job Description: We are seeking a highly skilled and experienced Process Integration Engineer to join our team. The successful candidate will be responsible for orchestrating and integrating critical process steps, such as: dielectric materials selection and application lithography wet + dry clean/etch/develop processes PVD and electroplating into a coherent, manufacturable process flow for fine-pitch, next-generation packaging architectures. You will support finalizing various Process Integration Plans, defining design rules, managing process window tradeoffs across module boundaries, and be the primary technical decision-maker to help navigate constraints in the full process flow. You will work daily with the lithography, wet/dry process, dielectric, and plating engineers, translating their individual process capabilities into a working end-to-end flow, while also engaging with device/package design teams on architectures feasibility. In an early-stage environment, this role carries enormous influence on the finalized architecture and build-up decisions.   Key Responsibilities: Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management. Develop and implement process integration strategies to optimize production yield and efficiency. Coordinate with cross-functional teams to ensure seamless integration of processes. Monitor and analyze process performance, identifying areas for improvement. Ensure compliance with industry standards and safety regulations. Troubleshoot and resolve process-related issues in a timely manner. Maintain detailed documentation of processes and procedures. Generate innovative ideas for patent filings.   Required Skills: Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch) Statistical process control and DOE methodology for multi-variable, multi-step process optimization Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test) Understanding of registration, overlay, and CD budget allocation across sequential build-up layers Fluent in English; proficiency in Korean is a plus.   Preferred Skills Experience with glass core substrates Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges Experience with any next-gen architecture enablement: glass co