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PRINCIPAL MECHANICAL ENGINEER – OSFP MODULE DESIGN About Lumilens   At Lumilens, we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. Join our experienced team to help shape the next generation of high-speed optical connectivity.   POSITION SUMMARY We are seeking an experienced Principal Mechanical Engineer to lead the architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules, including 800G, 1.6T, and future pluggable platforms based on the OSFP ecosystem.   This role requires deep expertise in high-speed electro-mechanical packaging, thermal management, precision tolerance engineering, EMI/EMC compliance, materials engineering, and large-scale manufacturing/NPI execution. You will work cross-functionally with optics, signal integrity, electrical, thermal, manufacturing, reliability, and supplier teams to deliver high-performance products at hyperscale production volumes.   KEY RESPONSIBILITIES - Lead end-to-end mechanical design and development of OSFP transceiver modules and related hardware - Define module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal paths - Design precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMs - Optimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and cost - Drive advanced thermal solutions for high-power DSP and optical engines - (Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD tools - Develop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selection - Lead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testing - Define GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfaces - Design EMI shielding solutions including conductive gaskets, coatings, and grounding strategies - Drive NPI activities from concept through mass production - Establish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities - Lead supplier qualification and manufacturing transfer activities - Support yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEA - Mentor and technically lead engineering teams   REQUIRED QUALIFICATIONS - Bachelor’s or Master’s degree in Mechanical Engineering or related field - 12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware - Strong expertise in OSFP/QSFP mechanical systems, thermal management, and precision design - Proficiency in Creo, SolidWorks, or NX CAD tools - Strong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering   PREFERRED QUALIFICATIONS - Experience with 800G/1.6T optical modules - Knowledge of co-packaged optics or near-packaged optics - Experience with copper alloys, Zamak die casting, advanced TIMs, and thermal materials - Familiarity with OSFP MSA specifications and high-volume manufacturing models - Six Sigma certification or patent publications preferred   KEY SKILLS - Mechanical architecture leadership - Thermal design & simulation (optional) - NPI & manufacturing transfer - Supplier management - Cost optimization / should-cost analysis - DFMEA / PFMEA - Root cause analysis - Program leadership - Executive-level technical presentation skills   IDEAL BACKGROUND / INDUSTRIES - Optical networking - Hyperscale data centers - Semiconductor systems - Tel