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CHAOS Industries is redefining modern defense with a multi-product portfolio that gives the ultimate advantage—domain dominance. The company's products are powered by Coherent Distributed Networks (CDN™), empowering warfighters, commercial air operators, and border protection teams to act faster, adapt rapidly, and stay ahead of evolving threats.  CHAOS Industries was founded in 2022 and has raised a total of $1 billion in funding from leading investors, including 8VC, Accel, and Valor Equity Partners. The company is headquartered in Los Angeles, with offices in Washington, D.C., San Francisco, San Diego, Seattle, and London. For more information, please visit www.chaosinc.com . Role Overview: Serve as the Packaging Engineering authority for outbound logistics of hardware, ranging from sensitive electronics and RF systems to bulk material Architect scalable packaging systems in support of a full-rate production environment Consider product fragility and logistics conditions and produce robust, repeatable packaging designs. Support make vs buy packaging trades. Coordinate with suppliers to procure pre-fab shipping material or produce custom solutions at rate Ensure packaging solutions support high-rate pack-out, low variability, and field performance Own packaging system readiness for production ramp (LRIP → FRP) Balance protection, cost, and operational efficiency in all packaging decisions Responsibilities:  Production System Architecture Work closely with Hardware Design and Graphic Design to develop packaging concepts and production-ready designs for RF systems and electronics assemblies Design optimal packaging systems including: Cushioning strategy (foam systems, isolation approaches) ESD-safe material selection and integration Protective cases, crates, and transport fixtures Restraint and retention features for sensitive hardware Define packaging configurations for multiple shipping modes (parcel, LTL, air, freight) Ensure packaging solutions are modular, repeatable, and scalable at rate Requirements Translation & Product Protection Translate product characteristics into packaging requirements: Mass properties, CG, fragility points Connector exposure and handling risks ESD sensitivity Define protection strategies against: Shock and drop events Vibration during transit Compression and stacking loads Partner with hardware engineering to align on practical protection thresholds vs. theoretical limits Ensure packaging designs reflect real-world handling variability , not idealized conditions High-Rate Pack-Out & Product Integration Design packaging systems for high-throughput manufacturing environments Optimize pack-out for: Takt time and line flow Minimal touch time and handling steps Error-proofing (poka-yoke) and correct orientation Repeatability across operators and shifts Develop pack-out strategies including: Kitting and material staging Standard work and visual instructions Ensure packaging does not introduce rate constraints or production bottlenecks Support transition from prototype builds to full-rate production without redesign   Minimum Requirements: Bachelor’s degree in Mechanical Engineering, Packaging Engineering, Industrial Engineering, or related STEM field 4–8+ years of experience in packaging design for electronics, RF systems, or sensitive hardware Demonstrated experience delivering custom packaging solutions from concept through production Strong understanding of: Packaging materials (foam systems, corrugate, plastics, cases Real-world shipping and handling conditions High-rate production and pack-out environments Proficiency with CAD tools (SolidWorks or equivalent) and PDM/PLM systems Experience integrating packaging into manufacturing and logistics workflows   Preferred Requ