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Manufacturing Operations Technical Programme Manager – Silicon and Packaging   Fractile is building silicon, systems and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost.    We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale.    Reporting into the Director of Programmes, the Manufacturing Operations Technical Programme Manager will  manage the silicon production, packaging design, packaging manufacturing, and delivery flow through to our contract manufacturer.    This role will act as the key interface between Fractile, the foundry, OSAT partner and the internal operations team, ensuring that technical milestones, schedules, risks, and handoffs are tightly managed from wafer production through to packaged silicon delivery.   What You’ll Do   Hardware Programme Delivery   Own the end-to-end project plan from wafer production through packaged silicon delivery   Coordinate day-to-day activity with foundry, OSAT, packaging, logistics, and contract manufacturing partners.   Track milestones across wafer starts, fab progress, packaging, assembly, final test, qualification, and shipment.   Manage risks, dependencies, schedule changes, and timely issue resolution, working closely with team leads and programme managers for silicon, hardware systems and hardware test internally and external partners and suppliers   Ensure manufacturing documentation, test requirements, quality requirements, and build readiness materials are complete   Support NPI, prototype builds, qualification, and production ramp   Lead manufacturing operations programme reviews that surface risk early and clearly and contribute to overall programme portfolio reviews   In addition, you will contribute to the development of the Programmes Team:    Contribute to the design and rollout of scalable programme management practices across Fractile, covering planning, forecasting, reporting, risk and change control   Bring proven patterns from previous environments and adapt them to our development stage, pace and constraints rather than importing process for its own sake   Help establish shared tooling, templates and review cadences that work consistently across silicon, hardware, manufacturing and software workstreams   What We’re Looking For   Experience:   5+ years in technical project management, operations, supply chain, or programme management in semiconductors or complex hardware   Experience working with foundries, OSATs, packaging suppliers, or contract manufacturers   Strong understanding of semiconductor production and packaging flows   Ability to manage complex schedules, multiple stakeholders, technical dependencies, supplier risks, and cross-functional execution.   Experience using tools such as Jira, Confluence, Linear, Asana, Smartsheet, MS Project or PLM systems   Experience working in a rapidly scaling organisation building process on the way   Experience in the following areas would be an advantage:   Advanced packaging, high-performance compute, chiplets, 2.5D/3D integration, or HBM-based packages.   Familiarity with silicon bring-up, NPI, qualification, yield tracking, and production ramp.   Working with Asian semiconductor supply chains and partners.