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Electromechanical Packaging Engineer

Claros
CompanyClaros
CategoryEngineering
LocationTorrance
RemoteHybrid
EmploymentNot stated
LevelNot stated
SalaryNot stated by the employer
Posted30 Jun 2026
Last verified31 Jul 2026
SourceEmployer career page (greenhouse)
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Description
Claros is a power management solutions company that is innovating at the intersection of power and compute to make AI more sustainable and widely available. By driving down the cost and complexity of power delivery and leveraging innovative hardware and software, the company seeks to decrease energy consumption, optimize power delivery, increase compute performance, and maximize the efficiency of AI operations. About The Team We are open-minded, fast paced, problem solvers that value open dialogue and candor. Our passion is to challenge the status-quo and we embrace transformational thinking.  Our response is never “no, but….” instead “yes, if….”.  We are mindful of our personal and organizational blinders and try to build an environment where our team members are At Their Best. What You Will Do The Electromechanical Packaging Engineer will be working with a Lead Engineer and be responsible for: Support chip scale packaging design and HDI organic substrate layout for integrated voltage regulator product line.  Collaborate with substrate layout, ASIC design, and manufacturing engineers.  Create mechanical drawings for substrate fabrication and packaged part assembly. Work with vendors for components, assembly, and test. What You Bring Minimum BS in Mechanical or Electrical engineering, MS or higher-level degree preferred.  5+ years’ experience with microelectronics packaging, and/or PCB design Knowledge of foundry processes and chip scale assembly processes Understanding of how electrical design requirements impact substrate layout and interconnect selection Proficient with 3D mechanical CAD software (Creo, NX, Catia, etc.), generating mechanical drawings, and GD&T Ability to read and create electrical schematics Familiarity with tape out processes for wafers and substrate  Basic understanding of Form, Fit, Function elements in design for manufacturability (DFM). willingness to learn new concepts and techniques and concepts Familiarity with PCB design tools (Altium, Cadence, Mentor, etc.) is a plus Basic understanding of component level thermal analysis is a plus Willingness to be in the office in Torrance, CA a minimum of 3 days per week  What We Offer Career track opportunity with potential for rapid advancement with strong performance as the firm grows   100% employer paid, comprehensive health care including medical, dental, and vision for you and your family. Paid maternity and paternity for 14 weeks at employees' normal pay.  Unlimited PTO, with management approval.  Opportunities for professional development and continued learning.  Optional 401K, FSA, and equity incentives available. Salary Range :  $150,000 – $200,000. This represents the typical salary range for this position based on experience, skills, and other factors.     Our Red Cell Partners Benefits:   Career track opportunity with potential for rapid advancement with strong performance as the firm grows    100% employer paid, comprehensive health care including medical, dental, and vision for you and your family.   Paid maternity and paternity for 14 weeks at employees' normal pay.   Unlimited PTO, with management approval.   Opportunities for professional development and continued learning.   Optional 401K, FSA, and equity incentives available.   Applicant Data Disclosure     By submitting an application, you acknowledge that Red Cell Partners, LLC ("Red Cell") uses third-party service providers to facilitate its recruitment and hiring processes. These providers include applicant tracking systems, candidate verification platforms, and fraud detection tools (collectively, "Hiring P
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Electromechanical Packaging Engineer — Claros · Job Opportunities API