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About the Role We are seeking an experienced Design-for-Test (DFT) Engineer to join our silicon engineering team and help stand up the DFT function alongside the architecture and physical-design (PD) teams. This is a ground-floor role on a leading-edge multi-die package. You will work across all aspects of the DFT discipline—from architecture and RTL insertion through pattern generation, verification, silicon bring-up, and production test—with a particular focus on solving test access for a multi-die package from the ground up. You will partner with design, verification, physical design, and product/test engineering to help deliver high-quality, testable, and yield-ready silicon. What you'll do:  Help build out and advance the DFT flow—insertion, pattern generation, verification, and signoff—integrated into the broader RTL-to-GDSII methodology Architect and implement test access for our multi-die package—post-package scan-chain access, known-good-die (KGD) sorting and screening, die-to-die (D2D) interconnect test, and a package-level test-access architecture designed in from the start rather than retrofitted Implement DFT structures across the full range: scan (stuck-at, transition/at-speed), compression, boundary scan (JTAG/IEEE 1149.x), and IEEE 1500 core wrapping Implement and verify Memory BIST, with particular emphasis on external MBIST controllers and shared/centralized BIST architectures serving distributed memory instances Drive ATPG, fault simulation, coverage closure, and pattern conversion/porting to the ATE environment (STIL/WGL) Perform DFT verification: scan chain integrity, pattern verification, and gate-level simulation (with SDF/timing) across all test modes Help define and review DFT specifications, test access architecture, and test budgets (pin count, test time, coverage targets) Support silicon bring-up, debug, diagnosis, and yield/failure analysis, correlating ATE results back to design Collaborate with physical design on scan stitching, test point insertion, timing, and power-aware test (DFT interaction with power domains/UPF) Document methodology and continuously automate and improve the flow What we're looking for  BS/MS in Electrical Engineering, Computer Engineering, or related field. 7+ years of hands-on DFT engineering on complex digital SoC/ASIC designs Breadth across all of DFT — architecture, insertion, ATPG, BIST, boundary scan, verification, and silicon test — not just one sub-domain DFT flow development — building, automating, and maintaining flows, not just running them Hierarchical / core-wrapping DFT — hands-on architecting and implementing test at the core/block level Multi-die / advanced-package DFT — post-package scan access, known-good-die (KGD) sorting, die-to-die interconnect test, and test-access architecture Deep Siemens Tessent expertise — Scan & ATPG (TestKompress), MemoryBIST (incl. external/shared MBIST), BoundaryScan/IJTAG (SSN a plus) Strong command of the fundamentals — scan insertion, ATPG (stuck-at/transition/path-delay), fault models, compression, JTAG/1149.x, IEEE 1500, scan-chain architecture, and coverage analysis Gate-level simulation of test modes / DFT pattern verification; scripting for flow automation (Tcl, Python, Perl) Familiarity with ATE pattern formats (STIL/WGL) and the design-to-tester handoff; solid RTL (Verilog/SystemVerilog) and SDC Low-power DFT (UPF/CPF, power-aware ATPG, retention/isolation test) (preferred)  Compensation Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.  Visa Sponsorship DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and