2027校招-封装工程师/Packaging Engineer
edbz
| Company | edbz |
| Category | Uncategorised |
| Location | Chengdu, Sichuan, China |
| Remote | — |
| Employment | Not stated |
| Level | Not stated |
| Salary | Not stated by the employer |
| Posted | 31 Jul 2026 |
| Last verified | 1 Aug 2026 |
| Source | Employer career page (oracle) |
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