| Principal Packaging Design Integration Engineer (2026 New College Graduate) | — | — | — | — | 31 Jul 2026 |
| Director - Manufacturing Infrastructure & Applications Leader | Bengaluru | On-site | — | — | 31 Jul 2026 |
| Principal Packaging Integration Engineer (2026 New College Graduate) | — | — | — | — | 31 Jul 2026 |
| Senior Engineer Failure Analysis | SG | — | — | — | 31 Jul 2026 |
| Principal Engineer Signal Integrity Power Integrity | Richardson | On-site | — | — | 31 Jul 2026 |
| Robotics and Automation Engineering Intern | — | — | — | — | 31 Jul 2026 |
| M365 AI & Collaboration Engineer - Copilot | Bengaluru | On-site | — | — | 31 Jul 2026 |
| Sr Analyst Manufacturing Finance | SG | — | — | — | 31 Jul 2026 |
| AI/ML Compiler & Runtime Software Engineer | Pune | On-site | — | — | 31 Jul 2026 |
| Principal Attorney Commercial Agreements | Richardson | On-site | — | — | 31 Jul 2026 |
| Sr. Engineer, Integration & Yield (300mm) | SG | — | — | — | 31 Jul 2026 |
| Sr Analyst Tax & Subsidies | Austin | On-site | — | — | 30 Jul 2026 |
| Lead site communications, media relations and community engagement | — | — | — | — | 30 Jul 2026 |
| Sr Technician Equipment Engineering - PCS (Nights) $5,000 Sign On Bonus | New York | On-site | — | — | 30 Jul 2026 |
| Senior Director Business Development | Santa Clara | On-site | — | — | 30 Jul 2026 |
| Senior AI Software Application Engineer | Yokohama | On-site | — | — | 30 Jul 2026 |
| Senior Credit Analyst Finance | Bengaluru | On-site | Senior | — | 30 Jul 2026 |
| Junior Financial Analyst Finance | Dresden | On-site | Entry | — | 30 Jul 2026 |
| Assoc Eng Equipment Engineering | — | — | — | — | 30 Jul 2026 |
| Silicon Photonics Technology Architect / Senior System Architect for Data Center Applications | New York | On-site | — | — | 30 Jul 2026 |
| Sr Assoc Eng Process Engineering | Penang | On-site | — | — | 30 Jul 2026 |
| Senior Technician Diffusion Equipment Engineering (Days) | — | — | — | — | 29 Jul 2026 |
| Technical Solution Architect Engineering | New York | On-site | Mid | — | 29 Jul 2026 |
| Supervisor Logistics Logistics & Transport | New York | On-site | Manager | — | 29 Jul 2026 |
| Principal Engineer Device Modeling & Characterization | Bengaluru | On-site | — | — | 29 Jul 2026 |
| Manufacturing Operators - Night Shift Up To $5,000 Sign-On Bonus! | — | — | — | — | 29 Jul 2026 |
| Employee Communications and Engagement Partner – Principal Specialist | Santa Clara | On-site | — | — | 29 Jul 2026 |
| Assoc Eng Equipment Engineering | SG | — | — | — | 29 Jul 2026 |
| MTS TD Integration Engineering (eNVM) | SG | — | — | — | 29 Jul 2026 |
| Sr Engineer, Process Engineering | Penang | On-site | — | — | 29 Jul 2026 |
| Process Engineer Engineering | Penang | On-site | — | — | 29 Jul 2026 |
| Engineer Design Enablement | — | — | — | — | 29 Jul 2026 |
| Principal Packaging Design Integration Engineer | — | — | — | — | 28 Jul 2026 |
| OneStream Finance Administrator | — | — | — | — | 28 Jul 2026 |
| Senior Technical Staff, Field Applications Engineering | Seoul | On-site | — | — | 28 Jul 2026 |
| RF Technology Development Engineer - MTS | — | — | — | — | 28 Jul 2026 |
| Anaplan Solution Architect (Remote Work, US) | — | Remote | — | — | 28 Jul 2026 |
| Advanced Packaging Modeling Engineer | New York | On-site | — | — | 28 Jul 2026 |
| Principal Packaging Integration Engineer | — | — | — | — | 28 Jul 2026 |
| Revenue Operations Manager Operations & Admin | Austin | On-site | Manager | — | 28 Jul 2026 |
| Sr. Process Engineer - Photolithography | — | — | — | — | 28 Jul 2026 |
| Principal Engineer, Process Engineering (Litho) | SG | — | — | — | 28 Jul 2026 |
| Sr. Waferfab Technician - Post Fab (N2 Shift) | — | — | — | — | 28 Jul 2026 |
| Sr. Equipment Engineer - PVD (Physical Vapor Deposition) | — | — | — | — | 28 Jul 2026 |
| Sr. Waferfab Technician - Post Fab (N1 Shift) | — | — | — | — | 28 Jul 2026 |
| NCG 3D Heterogeneous Integration Engineer-Cryogenic 3D packaging | Leuven | On-site | — | — | 28 Jul 2026 |
| Internship - Cross Module Digital Manufacturing & Process Optimization | Dresden | On-site | — | — | 28 Jul 2026 |
| Engineer, Process Engineering Engineering | Penang | On-site | — | — | 28 Jul 2026 |
| Device Engineering Intern, ULP CMOS (Summer 2026) Engineering | New York | On-site | Intern | — | 28 Jul 2026 |
| Position 2H University Intern - FR CMOS Device Engineering Engineering | — | — | Intern | — | 28 Jul 2026 |
